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In an industry that has continued to seek faster and better performance through smaller feature requirements, Dow’s CTO 2000 Trimming Overcoat has stepped in to fulfill an unmet need. Dow’s CTO 2000 Trimming Overcoat is a spin-on photoresist trim overcoat, a chemical post-treatment that enables patterning of smaller features on silicon wafers than photolithography can do alone. ArF laser lithography had reached a limit on the patterning scale achievable, and though extreme ultraviolet (EUV) technology can resolve this in the future, this technology will not be viable for high-volume manufacturing for many years. In order to meet manufacturers’ needs now, Dow has developed CTO 2000 Trimming Overcoat which enables ArF methods and existing equipment to go to smaller critical dimensions. In addition, CTO2000 demonstrates exceptional defectivity performance. The product is a game changer in photolithography, allowing semiconductor manufacturers to keep pace with Moore’s Law through smaller critical dimensions, fewer defects and low cost of ownership, all without capital investment for new equipment.