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The advent of Silicon Photonics (SiP) means photonic elements are now being fabricated alongside microelectronics on silicon wafers. SiP technology offers many benefits: it facilitates the next levels of data throughput and parallelism, it enables new data center architectures, and it addresses unsustainable escalating energy demands. PI's innovation: Fast, Multi-Channel Alignment System for Next Generation Silicon Photonics Test & Production is a novel, modular, industrial-class system that automates SiP alignments for packaging and test, and does so with groundbreaking speed, precision and device safety. PI's FMPA is absolutely key to economic deployment of energy-efficient, high-capacity data interconnects fundamental to tomorrow’s data center architectures.