High Performance Two-Phase Cold-Plate for Automotive Power Electronics

Organization: Toyota Research Institute of North America
Co-Developer(s): Toyota Motor Corp., Purdue University, Cooling Technologies Research Center
Year: 2016

Toyota’s High Performance Two-Phase Cold-Plate for Automotive Power Electronics represents a significant leap forward in power electronics packaging design from current state-of-the-art single-phase cold plates. The novel design mates liquid jet impingement with an advanced heat sink using pin fins coated with a metallic porous layer. The cold plate design dissipates power densities that are four times higher than the current generation in a more compact package. The performance is achieved with three times lower pressure drop, which means that the overall parasitic power of the cooling system (pumping power) is significantly reduced. The low pumping power provides a substantially higher overall Coefficient of Performance for the system. The design was developed considering not just the overall performance but also adaptability and scalability of the design to future power electronics packaging needs.

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